STMicroelectronics_STD3NK100Z

STMicroelectronics
STD3NK100Z  
Single FETs, MOSFETs

STMicroelectronics
STD3NK100Z
278-STD3NK100Z
Ersa
STMicroelectronics-STD3NK100Z-datasheets-1167285.pdf
MOSFET N-CH 1000V 2.5A DPAK
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    STD3NK100Z Description

    The STD3NK100Z is a N-channel MOSFET transistor manufactured by STMicroelectronics. Here is a brief description of the model, its features, and potential applications:

    Description:

    The STD3NK100Z is a high-power, high-voltage N-channel MOSFET transistor. It is designed for use in a variety of applications that require efficient switching and high current handling capabilities.

    Features:

    1. N-channel MOSFET design for efficient switching and low on-resistance.
    2. High voltage rating of 100V, making it suitable for use in high voltage applications.
    3. High current handling capability, with a continuous drain current (Id) of up to 39A.
    4. Low on-state resistance (RDS(on)) of 4.5 mΩ max, which helps reduce power dissipation and improve efficiency.
    5. Logic level compatible gate input, allowing for easy integration with digital control circuits.
    6. Avalanche energy rating of 75 Joules, providing robust protection against transient voltage spikes.
    7. Available in a compact, through-hole package (TO-220) for easy installation and heat dissipation.

    Applications:

    The STD3NK100Z is suitable for use in a wide range of applications that require efficient switching and high current handling capabilities. Some potential applications include:

    1. Power switching and control in industrial and automotive systems.
    2. Motor control and driving circuits for electric vehicles, appliances, and industrial machinery.
    3. DC-DC converters and power supply circuits for high-power electronic devices.
    4. Battery management systems for electric vehicles and energy storage applications.
    5. High-power LED driving circuits for lighting applications.
    6. Inverter circuits for renewable energy systems, such as solar panel power conversion.

    Please note that the specific application requirements and design considerations may vary depending on the use case. It is essential to consult the datasheet and design guidelines provided by STMicroelectronics for detailed information on the STD3NK100Z's electrical characteristics, operating conditions, and recommended design practices.

    Tech Specifications

    Configuration
    Typical Turn-Off Delay Time (ns)
    Maximum Gate Source Leakage Current (nA)
    Input Capacitance (Ciss) (Max) @ Vds
    Gate Charge (Qg) (Max) @ Vgs
    Typical Rise Time (ns)
    PPAP
    Channel Mode
    Typical Turn-On Delay Time (ns)
    Product Status
    Automotive
    Drain to Source Voltage (Vdss)
    Supplier Package
    Maximum IDSS (uA)
    Package / Case
    Technology
    REACH Status
    Channel Type
    EU RoHS
    Maximum Continuous Drain Current (A)
    Moisture Sensitivity Level (MSL)
    Operating Temperature
    Maximum Pulsed Drain Current @ TC=25°C (A)
    Maximum Drain Source Voltage (V)
    Maximum Drain Source Resistance (mOhm)
    ECCN
    Supplier Temperature Grade
    Mounting Type
    Rds On (Max) @ Id, Vgs
    Standard Package Name
    Vgs(th) (Max) @ Id
    Typical Reverse Recovery Charge (nC)
    Pin Count
    Mounting
    Minimum Gate Threshold Voltage (V)
    Typical Reverse Transfer Capacitance @ Vds (pF)
    Lead Shape
    Current - Continuous Drain (Id) @ 25°C
    Typical Gate to Drain Charge (nC)
    SVHC
    Drive Voltage (Max Rds On, Min Rds On)
    HTSUS
    Package
    Typical Gate Charge @ Vgs (nC)
    Typical Input Capacitance @ Vds (pF)
    Category
    PCB changed
    HTS
    FET Type
    Number of Elements per Chip
    Typical Reverse Recovery Time (ns)
    ECCN (US)
    Maximum Power Dissipation (mW)
    Supplier Device Package
    Minimum Operating Temperature (°C)
    Maximum Operating Temperature (°C)
    Power Dissipation (Max)
    Typical Fall Time (ns)
    Process Technology
    Package Height
    Typical Gate to Source Charge (nC)
    Maximum Positive Gate Source Voltage (V)
    Mfr
    Vgs (Max)
    RoHS Status
    Typical Gate Threshold Voltage (V)
    FET Feature
    Maximum Gate Source Voltage (V)
    SVHC Exceeds Threshold
    Typical Gate Plateau Voltage (V)
    Package Length
    Typical Gate Charge @ 10V (nC)
    Maximum Diode Forward Voltage (V)
    Series
    Operating Junction Temperature (°C)
    Typical Output Capacitance (pF)
    Tab
    Part Status
    Maximum Gate Threshold Voltage (V)
    Package Width
    Base Product Number
    Unit Weight
    Id - Continuous Drain Current
    Fall Time
    RoHS
    Qg - Gate Charge
    Tradename
    Transistor Type
    Number of Channels
    Typical Turn-On Delay Time
    Height
    Maximum Operating Temperature
    Width
    Rds On - Drain-Source Resistance
    Mounting Style
    Vgs - Gate-Source Voltage
    Typical Turn-Off Delay Time
    Transistor Polarity
    Minimum Operating Temperature
    Vds - Drain-Source Breakdown Voltage
    Rise Time
    Length
    Forward Transconductance - Min
    Vgs th - Gate-Source Threshold Voltage
    Pd - Power Dissipation
    USHTS

    STD3NK100Z Documents

    Download datasheets and manufacturer documentation for STD3NK100Z

    Ersa STx3NK100Z      
    Ersa Mult Dev Inner Box Chg 9/Dec/2021       Box Label Chg 28/Jul/2016      
    Ersa STD3NK100Z View All Specifications      
    Ersa STx3NK100Z      
    Ersa New Lead Frame Design 17/Mar/2023      

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