Texas Instruments_CSD16409Q3

Texas Instruments
CSD16409Q3  
Single FETs, MOSFETs

Texas Instruments
CSD16409Q3
278-CSD16409Q3
Ersa
Texas Instruments-CSD16409Q3-datasheets-2078159.pdf
MOSFET N-CH 25V 15A/60A 8VSON
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CSD16409Q3 Description

CSD16409Q3 Description

The CSD16409Q3 is a high-performance N-Channel MOSFET from Texas Instruments, designed for applications requiring high efficiency and fast switching. With a drain-to-source voltage (Vdss) of 25V and a continuous drain current (Id) of 15A at 25°C and 60A at Tc, this device is suitable for a wide range of power electronics applications. The NexFET™ series offers superior performance with low on-resistance (Rds On) of 8.2mOhm at 17A and 10V, and a low gate charge (Qg) of 5.6nC at 4.5V, enabling fast switching and reduced power dissipation.

CSD16409Q3 Features

  • NexFET™ Series: Advanced technology for high efficiency and fast switching
  • Low Rds On (8.2mOhm) for reduced power loss
  • Low gate charge (5.6nC) for fast switching and reduced power dissipation
  • High Vdss (25V) and Id (15A/60A) for wide range of applications
  • Surface Mount packaging for compact design and ease of integration
  • REACH Unaffected and RoHS3 Compliant for environmental compliance
  • Moisture Sensitivity Level (MSL) 1 for unlimited storage time

CSD16409Q3 Applications

The CSD16409Q3 is ideal for a variety of power electronics applications where high efficiency, fast switching, and compact design are required. Some specific use cases include:

  1. Motor control: High efficiency and fast switching make it suitable for brushless DC motor control in applications like fans, pumps, and robotics.
  2. Power supply: Low Rds On and high Vdss make it suitable for power supply applications like battery chargers, power adapters, and LED drivers.
  3. Automotive electronics: The device's high current handling capability and robustness make it suitable for automotive applications like electric power steering, inverter systems, and battery management.
  4. Industrial control: Fast switching and low power dissipation make it suitable for industrial control applications like servo drives, inverters, and motor controllers.

Conclusion of CSD16409Q3

The CSD16409Q3 is a versatile and high-performance N-Channel MOSFET from Texas Instruments, offering superior efficiency, fast switching, and compact design. Its unique features and advantages make it an ideal choice for a wide range of power electronics applications, including motor control, power supply, automotive electronics, and industrial control. With its NexFET™ technology, low Rds On, and low gate charge, the CSD16409Q3 delivers exceptional performance and reliability, making it a preferred choice for demanding applications.

Tech Specifications

Configuration
Typical Turn-Off Delay Time (ns)
Maximum Gate Source Leakage Current (nA)
Input Capacitance (Ciss) (Max) @ Vds
Gate Charge (Qg) (Max) @ Vgs
Typical Rise Time (ns)
PPAP
Channel Mode
Typical Turn-On Delay Time (ns)
Product Status
Automotive
Drain to Source Voltage (Vdss)
Supplier Package
Maximum IDSS (uA)
Package / Case
Technology
REACH Status
Channel Type
EU RoHS
Maximum Continuous Drain Current (A)
Moisture Sensitivity Level (MSL)
Operating Temperature
Maximum Pulsed Drain Current @ TC=25°C (A)
Maximum Drain Source Voltage (V)
Maximum Drain Source Resistance (mOhm)
ECCN
Mounting Type
Rds On (Max) @ Id, Vgs
Standard Package Name
Vgs(th) (Max) @ Id
Typical Reverse Recovery Charge (nC)
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
Pin Count
Mounting
Minimum Gate Threshold Voltage (V)
Typical Reverse Transfer Capacitance @ Vds (pF)
Lead Shape
Current - Continuous Drain (Id) @ 25°C
Typical Gate to Drain Charge (nC)
SVHC
Drive Voltage (Max Rds On, Min Rds On)
HTSUS
Package
Typical Gate Charge @ Vgs (nC)
Typical Input Capacitance @ Vds (pF)
Maximum Power Dissipation on PCB @ TC=25°C (W)
Category
Maximum Gate Resistance (Ohm)
PCB changed
HTS
FET Type
Number of Elements per Chip
Typical Reverse Recovery Time (ns)
ECCN (US)
Maximum Power Dissipation (mW)
Supplier Device Package
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Power Dissipation (Max)
Typical Fall Time (ns)
Process Technology
Package Height
Typical Gate to Source Charge (nC)
Maximum Positive Gate Source Voltage (V)
Mfr
Vgs (Max)
Typical Drain Source Resistance @ 25°C (mOhm)
RoHS Status
Typical Gate Threshold Voltage (V)
FET Feature
Maximum Gate Source Voltage (V)
SVHC Exceeds Threshold
Typical Gate Plateau Voltage (V)
Package Length
Maximum Diode Forward Voltage (V)
Series
Typical Diode Forward Voltage (V)
Operating Junction Temperature (°C)
Typical Output Capacitance (pF)
Part Status
Maximum Gate Threshold Voltage (V)
Package Width
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)
Base Product Number
Unit Weight
Id - Continuous Drain Current
Fall Time
RoHS
Qg - Gate Charge
Tradename
Transistor Type
Number of Channels
Typical Turn-On Delay Time
Height
Maximum Operating Temperature
Width
Rds On - Drain-Source Resistance
Mounting Style
Vgs - Gate-Source Voltage
Typical Turn-Off Delay Time
Transistor Polarity
Minimum Operating Temperature
Vds - Drain-Source Breakdown Voltage
Rise Time
Length
Forward Transconductance - Min
Vgs th - Gate-Source Threshold Voltage
Pd - Power Dissipation
USHTS

CSD16409Q3 Documents

Download datasheets and manufacturer documentation for CSD16409Q3

Ersa Qualification Wire Bond 27/May/2014      
Ersa CSD16409Q3      
Ersa CSD16409Q3      
Ersa Qualification Revision A 01/Jul/2014      

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