Light Sensing Sensor: Discrete vs IC, Types & Uses

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1) What Is a Light Sensing Sensor?

A light sensing sensor (also called a light sensor, photodetector, or ambient light sensor—ALS) converts light into an electrical signal. In practice it is built in two ways: a discrete analog chain or an all-in-one sensor IC. Both exist; for most engineering use, ICs provide faster, more stable results.

Discrete Path

Sensor device: photodiode / phototransistor / LDR
Analog chain: TIA/Op-Amp → Comparator/ADC → MCU
Pros: flexible, very low BOM; Cons: calibration, temp drift, flicker handling

Sensor IC Path

On-chip: photodiode array + AFE + ADC + digital interface
Interfaces: I²C/SPI, interrupt (INT), registers for thresholds/integration
Built-ins: human-eye response, 50/60 Hz anti-flicker, temperature compensation

Discrete Quick View

Photodiode: current-mode, fast (µs), linear → needs TIA
Phototransistor: gain, mid-speed (µs–ms), can saturate
LDR: resistance-mode, slow (ms–s), large drift; check RoHS (cadmium)

IC Quick View

Outputs: lux / RGB / UV / proximity/ToF distance
Wiring: VDD + GND + SCL/SDA (+INT); decoupling and pull-ups
Time-to-market: fast; consistent accuracy across units and temperature

When to choose what: need stable lux/color, anti-flicker and quick delivery → pick a sensor IC. Need ultra-low BOM or custom spectrum/high-speed analog → consider the discrete chain.

light → discrete chain (photodiode→TIA→ADC) vs sensor IC (photodiode array→AFE/ADC→I2C) — Diagram comparing two implementations: discrete chain (photodiode to TIA to ADC) and sensor IC (on-chip photodiode array with AFE/ADC and I²C).

Light sensor / photodetector / ALS: umbrella terms covering discrete parts and sensor ICs.
LDR: discrete light-dependent resistor; not an IC.
Proximity/ToF: active distance sensing; usually IC/module, not an LDR upgrade.

Related reading: Comparator circuit · Transimpedance amplifier · ADC basics · I²C guide

2) Working Principles — Two Paths

Light becomes an electrical signal through two engineering routes: a discrete analog chain or an on-chip sensor IC. Remember: “digital interface ≠ digital physical quantity”—discrete parts output analog signals that can be digitized by a comparator/ADC, while sensor ICs digitize on chip and expose data via I²C/SPI.

2.1 Discrete Path (Photodiode / Phototransistor / LDR)

Photodiode (current-mode)

Light generates current I_ph roughly proportional to illuminance. Two modes: photovoltaic (0 V, low noise, slower) and photoconductive (reverse-biased, faster). Typical chain: PD → TIA → ADC/Comparator. Fast and linear.

Phototransistor

Internal gain converts I_ph to collector current; simple load resistor yields voltage output. Medium speed (µs–ms) and prone to saturation (asymmetric rise/fall).

LDR (light-dependent resistor)

Resistance R_LDR drops with light; used in a divider. Slow (ms–s), large temperature drift; many LDRs contain cadmium—check RoHS compliance.

Typical Topologies

PD + TIA (inverting op-amp): V_out ≈ I_ph · R_f → linear, fast.
Phototransistor + R_C: simple voltage output; avoid saturation by sizing R_C.
LDR divider: V_out = V_CC · R_fixed / (R_fixed + R_LDR); digitize with a comparator + hysteresis.

Design Cookbook (usable defaults)

TIA gain: pick R_f = V_FS / I_ph,max (e.g., V_FS=2.0–2.5 V).
TIA compensation: start with C_f ≈ 1 / (2π · R_f · f_BW), where f_BW is 1.5–2× required bandwidth.
Comparator hysteresis: set ΔV ≈ 5–10% of V_CC to suppress flicker near threshold.
LDR fixed resistor: choose R_fixed ≈ R_LDR at target illuminance (typical: dark 100 kΩ–1 MΩ; bright 1–10 kΩ).
Hardening: shielding/diffuser, black inner walls, ESD/TVS, supply decoupling.

photodiode current → transimpedance amplifier → MCU ADC — Discrete chain: photodiode generates current, TIA converts to voltage, MCU reads via ADC or comparator.

2.2 Sensor IC Path (ALS / RGB / UV / Proximity / ToF)

A sensor IC integrates the photodiode array, AFE, and ADC, then exposes data via I²C/SPI and an INT pin. It can output lux, RGB channels (R/G/B/Clear), UV indices, or proximity/ToF distance.

Programmable Parameters

Integration time: longer = better resolution & anti-flicker; latency ↑.
Gain/Range: auto/manual to avoid saturation across scenes.
Interrupt: upper/lower thresholds + hysteresis; no polling for backlight/dusk-dawn.

Human-Eye & Flicker Handling

ALS devices approximate the CIE photopic curve and offer 50/60 Hz anti-flicker via integration windows—crucial for indoor lighting.

Proximity / ToF

Active sensing with an emitter (IR/VCSEL) plus receiver; algorithms reject ambient light and output distance or proximity events. Often supplied as an IC/module including optics.

Quick Start (HW & FW)

VDD decoupling; SCL/SDA pull-ups sized to bus length; route INT per level.
Boot → set Gain/Integration Time → clear INT → read raw → convert to lux/indices.
Self-check: cover/uncover or flashlight test; verify raw counts and saturation flags.

ALS IC with photodiode array, AFE, ADC, I²C and INT pin — On-chip light sensor architecture: photodiode array with analog front end and ADC, exposing data via I²C and an interrupt line.

Need help choosing? Jump to Section 4: Discrete vs Sensor IC or go straight to Section 7: 7-Brand IC Picks.

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3) Types & Signals

Light sensors come in several types, each with a characteristic output signal (resistance / current / voltage / I²C/SPI) and preferred use cases (ambient light, RGB color, UV monitoring, proximity/ToF distance).

matrix of sensor types vs output: resistance/current/voltage/I²C — Quick matrix mapping light sensor types to their signal forms: resistance, current, voltage, or I²C/SPI digital.

LDR (resistance)

Ultra-low cost and simple divider readout, but slow (ms–s) with large temp drift and unit variance. Mostly visible-light response; UV sensitivity is limited and unstable. Check RoHS due to possible cadmium.

Photodiode / Phototransistor

Photodiode: current-mode, fast and linear; pair with a TIA (V≈I·R_f) or reverse-bias for speed. Phototransistor: voltage output with gain, mid-speed (µs–ms) but can saturate; good for simple thresholds/beam-break.

ALS IC (lux, I²C/SPI)

On-chip AFE+ADC outputs lux via I²C/SPI with human-eye response and 50/60 Hz anti-flicker. Best for backlight control, indoor lighting, and outdoor dusk-dawn sensing; tune Integration Time/Gain for range vs latency.

RGB / Color IC

Measures R/G/B/Clear channels for color temperature and display backlight tuning. Needs optical control (FOV/diffuser) to avoid local hotspots and color bias; supports threshold interrupts.

UV IC / UV Photodiode

UVA/UVB monitoring for automotive/outdoor/weathering tests. ICs output digital indices; PDs output current. Guard against direct sun saturation and temperature drift; optical filtering is common.

Proximity / ToF (distance)

Active sensing with IR/VCSEL emitter + receiver; algorithms reject ambient light and output distance or proximity events. Delivered as IC/module with optics—not an “LDR upgrade”.

Signal → MCU Pin

Resistance/Voltage/Current → ADC or comparator (add hysteresis); PD uses TIA for current-to-voltage.
I²C/SPI → digital bus with pull-ups/level match; use INT for threshold events.
Distance/Event → read registers or handle interrupts for proximity/ToF.

Reminder: digital interface ≠ digital physical quantity.

Need stable linear readings, anti-flicker, and fast time-to-market? Choose ALS/RGB/UV ICs. Building high-speed beam sensors or special spectra? Use photodiode + TIA. Only need dusk/dawn threshold at ultra-low BOM? LDR + comparator works. For proximity/distance, go straight to Proximity/ToF.

LDR: RoHS (cadmium), temperature drift, aging.
Indoor lighting: 50/60 Hz flicker—use ALS with proper integration time.
Outdoor: direct sun, rain/fog; use diffusers and proper IP/FOV design.
RGB/UV: control IR contamination and angle; ToF needs blackened walls to reduce crosstalk.

Continue to Section 4: Discrete vs Sensor IC or jump to Section 7: 7-Brand IC Picks.

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4) Discrete vs Sensor IC — How to Choose

Both routes “see” light, but they diverge on time-to-market, accuracy/linearity, temperature drift, and 50/60 Hz flicker immunity. Keep in mind: digital interface ≠ digital physical quantity.

Dimension	Discrete (PD/PT/LDR + TIA/Comparator)	Sensor IC (ALS/RGB/UV/Proximity/ToF)
BOM cost (unit)	Low–mid; peripherals & protection add variance	Mid; minimal peripherals
Dev time / time-to-market	Longer: analog design & calibration	Short: configure registers and ship
Linearity / accuracy / unit consistency	Design-dependent; batch variation common	Strong: on-chip AFE/ADC & compensation
Temperature drift / aging	Noticeable (LDR worst)	Low: temp compensation, factory trim
50/60 Hz flicker / EMI	Needs filtering, careful layout	Built-in anti-flicker windows/algorithms
Calibration & maintenance	Often requires batch calibration	Minimal to none
Unusual spectra / ultra-high speed	Strength: fully customizable analog chain	Model-limited; choose by datasheet range
Automotive / compliance	LDR may face RoHS issues	AEC-Q options widely available

radar chart comparing cost, time-to-market, accuracy, drift, flicker immunity — Visual comparison across dimensions: BOM cost, time-to-market, accuracy/linearity, temperature drift, flicker immunity.

Decision Tree

Small batch or urgent launch? → Choose Sensor IC.
Need stable lux/color and indoor anti-flicker? → Choose Sensor IC.
Unconventional spectrum or µs-level ultra-high speed? → Choose Discrete (PD + TIA).
Only a dusk/dawn threshold and ultra-low BOM? → Choose LDR + comparator.

Use case	Recommended	Why
Display/backlight control	ALS IC	Human-eye response + anti-flicker; smooth readings
Outdoor lighting (dusk-to-dawn)	ALS/UV IC (IP-rated)	Low drift, better lifetime and consistency
Industrial beam/through-beam	Photodiode + TIA	High speed and dynamic range; customizable optics
Security light with day/night inhibit	ALS IC + PIR	Threshold interrupt + false-trigger suppression
Automotive cabin/ambient	AEC-Q ALS/UV IC	Compliance and traceability

Total Cost of Ownership (TCO): Discrete parts may have a lower unit price, but NRE, debugging, batch calibration, and upkeep raise total cost—especially in small runs. Sensor ICs cost slightly more per unit but reduce engineering time and post-sale risk.

Choose Sensor IC for small batches, fast schedules, stable readings, and indoor anti-flicker. Choose Discrete (PD + quality TIA/comparator) only for ultra-low BOM, unusual spectra, or extreme speed.

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5) Application Playbook

Match the use case to a sensor type and signal. Each scenario below gives a recommended IC path for fast, consistent results and a discrete fallback when you truly need it. Remember: PIR detects people; an ALS detects light—they work best together.

Display / Backlight Outdoor Dusk-to-Dawn Motion-Linked Lighting Industrial / Security Automotive Cabin / ADAS

Display / Backlight Auto-Brightness

Recommended: ALS IC (human-eye response + 50/60 Hz anti-flicker).
Fallback: photodiode + ADC (add software smoothing).

Why: stable lux, smooth UX, consistent across units.
Wiring: VDD, GND, I²C (pull-ups), optional INT.
Defaults: Integration 100–200 ms; auto-gain; dual thresholds for day/night.
Pitfalls: direct glare and panel bleed—use diffuser/FOV control.
IC picks: see Section 7 (TI OPT3001 / Renesas ISL29023 / onsemi NOA1305).

Outdoor Dusk-to-Dawn Lighting

Recommended: ALS/UV IC in IP-rated housing (low drift, long life).
Avoid: LDR (temperature drift, aging, RoHS concerns).

Wiring: ALS via I²C + relay/driver, or INT → logic.
Defaults: Integration 200–400 ms; threshold e.g., sunset < 30–50 lux.
Pitfalls: headlight/sun glare—use hooding; rain/fog—hydrophobic lens & drainage.
Automotive-grade options: Melexis UV / onsemi ALS—see Section 7.

Motion-Linked Lighting (PIR + ALS)

Recommended: PIR for motion + ALS IC for daylight inhibit.
Fallback: PIR + LDR divider + comparator (cheap, drifty).

Wiring: PIR OUT → MCU, ALS INT → MCU, logic AND → light driver.
Defaults: ALS lux threshold; PIR sensitivity & hold time; debounce in firmware.
Pitfalls: heat sources, moving curtains, self-illumination feedback loops.
Short-range presence: combine proximity/ToF (e.g., ST VL53) with ALS.

Industrial Sensing / Security Triggers

Recommended: photodiode + TIA (through-beam / retro-reflective).
Fallback: proximity/ToF module (short range, complex background).

Wiring: reverse-biased PD → TIA → comparator/ADC; align optics & shield.
Defaults: BW 1.5–2× target; R_f from full-scale; blackened walls vs crosstalk.
Pitfalls: ambient light, specular reflections, EMI, mechanical drift.
Design help: TIA guide · Comparator.

Automotive Cabin / ADAS Assist

Recommended: AEC-Q ALS/UV/IR IC (Melexis / onsemi / Renesas).
Fallback: automotive PD + AFE/ADC for unusual spectra/mounting angles.

Wiring: I²C + diagnostics; consider ISO 7637/ESD; harness length & noise.
Defaults: gain/IT vs ambient curve; saturation guards for bright sun.
Pitfalls: windshield filtering, sun angle, thermal cycling/aging.
See car-grade picks in Section 7.

map from application to recommended sensor type (ALS/RGB/PD+TIA/PIR+ALS) — Application map linking use cases to sensor choices: ALS/RGB for displays, ALS/UV outdoor, PIR+ALS for motion lighting, PD+TIA for industrial beams, AEC-Q ALS/UV for automotive.

Rule of thumb: everyday applications → IC first; choose discrete only for special spectra, extreme speed, or bare-minimum thresholds. Ready to source parts or need pin-to-pin options? See Section 7.

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6) Integration Cheatsheets

A pocket guide for wiring and bring-up: how to connect, how to set, and how to sanity-check. Prevent threshold drift, false triggers, and over-voltage before they bite you.

6.1 Discrete Cheatsheet (LDR / Photodiode / Phototransistor)

Common Topologies

LDR divider: V_out=V_CC·R_fixed/(R_fixed+R_LDR) → comparator sets threshold.
Photodiode + TIA (inverting): V_out≈I_ph·R_f → fast & linear.
Phototransistor + R_C: simple voltage readout; watch saturation.

Quick Sizing

TIA gain: choose R_f=V_FS/I_ph,max (e.g., V_FS=2.0–2.5 V).
TIA compensation: C_f≈1/(2π·R_f·f_BW) with f_BW≈1.5–2× target.
LDR fixed resistor: pick R_fixed≈R_LDR at target lux (dark 100 kΩ–1 MΩ; bright 1–10 kΩ typical).
Comparator hysteresis: ΔV≈5–10%·V_CC to suppress flicker/chatter.

Hardware Do / Don’t

Do: reverse-bias PD; keep analog loop short; decouple near sensor; use diffuser/black walls; TVS + series R for ESD.
Don’t: run weak analog over long cables; treat LDR as a precision lux meter; ignore RoHS (cadmium) & temp drift.

Bring-Up & Debug

Kill indoor lights to see 50/60 Hz impact; add hysteresis at threshold.
Scope TIA output while sweeping light (flashlight) to confirm bandwidth and no saturation.

6.2 Sensor IC Cheatsheet (ALS / RGB / UV / Proximity/ToF)

I²C Physical Layer

Pull-ups: short bus 4.7 kΩ; mid-length 2.2–3.3 kΩ; very long → slow to 100 kHz.
Rule of thumb: R_PU,max≈t_r/(0.8473·C_bus); keep C_bus low.
Level-shift 5 V ↔ 3.3 V with a bidirectional MOSFET translator.

Power & Pins

Decouple VDD with 0.1 µF + 1 µF close to the IC.
ADDR strap for I²C address; INT is often open-drain → add pull-up.
Route SCL/SDA in parallel, equal length; avoid high-current loops; common ground reference.

FW Init “Golden Sequence”

Power-up & soft reset.
Set Integration Time & Gain.
Clear interrupts; program upper/lower thresholds + hysteresis.
Poll or handle INT; read raw → convert to lux/RGB/UV.
Watch saturation flags; enable auto-range if available.

Smoothing & Anti-Flicker

EMA: y_t=α·x_t+(1−α)·y_t−1, start with α≈0.2.
Indoor: Integration 100–200 ms for 50/60 Hz rejection.
Outdoor/fast: shorten integration + use threshold interrupts.

VDD → ALS IC → I²C pull-ups → MCU with INT line — Typical ALS IC wiring: VDD decoupling, I²C lines with pull-ups to MCU, and an optional open-drain INT line.

6.3 Quick Self-Test

LDR: multimeter on Ω—cover vs. flashlight: dark ≈ 100 kΩ–1 MΩ, bright ≈ 1–10 kΩ (typ.).
Photodiode + TIA: sweep a flashlight; scope V_out step & rise time to verify bandwidth/saturation.
ALS IC: A/B test (cover vs. light); read raw counts & status/saturation; confirm threshold interrupt fires.

6.4 Safety & Limits

Max ratings: respect datasheet limits; add series limit for bias/dividers; protect against reverse polarity.
EMI/ESD: TVS, series R/RC, tight loops; isolate long runs from high-di/dt paths.
Optics: pick FOV, hooding, diffuser, and black surfaces to avoid self-illumination and reflections.

Related reading: Comparator circuit · Transimpedance amplifier · I²C guide. Next: Section 7: 7-Brand IC Picks.

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7) 7-Brand IC Picks

Curated, mainstream parts that balance availability, documentation, and ease of integration. If a brand lacks a pure ALS, we suggest a combo path (photodiode + AFE/ADC or MCU ADC). Use these as “first picks” for small-batch builds and quick pilots.

Use case	Recommended series	Notes
Display/backlight (lux)	TI OPT3001 · Renesas ISL29023 · onsemi NOA1305	Human-eye response + 50/60 Hz anti-flicker
Color / CCT control	ST VD6281 · Renesas ISL29125	RGB(+Clear) channels with threshold interrupts
Proximity / short-range distance	ST VL53 (ToF modules)	Emitter + receiver + on-chip ranging
UV monitoring / outdoor	Melexis MLX75305/306 · onsemi UV PD (alt.)	UVA/UVB focus; consider optics & temp drift
Custom analog chain / high resolution	Microchip MCP3421 + PD · NXP PCF8591 + PD	Combo path (PD + AFE/ADC) for fine control

TI

OPT3001 (ALS, I²C) · OPT101 (PD+TIA, analog Vout)

Features: human-eye curve, anti-flicker family; OPT101 speeds analog prototyping.
Use: backlight, indoor lighting, quick analog chain POC.
Notes: set integration/gain to avoid saturation under direct light.
Alt (function domain): ≈ Renesas ISL29023 · ≈ onsemi NOA1305.

STMicroelectronics

VD6281 (RGB/ALS) · VL53 family (ToF proximity modules)

Features: color channels + flicker detection; VL53 integrates emitter/receiver for ranging.
Use: color temperature & backlight tuning; presence/hand detection.
Notes: manage FOV/diffusers; ToF optics need blackened walls to reduce crosstalk.
Alt: VD6281 ≈ Renesas ISL29125 (RGB domain).

NXP

Combo: Photodiode + PCF8591 (I²C ADC) or S32K/MCX MCU (12-bit ADC)

Features: system-level builds leveraging automotive MCU ecosystem.
Use: AEC projects needing deep integration & custom algorithms.
Notes: verify ADC sampling & anti-aliasing; consider EMI on harness.
Alt: compare Microchip MCP3421 (hi-res) or TI ADS1xxx for ADC roles.

Renesas (Intersil)

ISL29023 (ALS) · ISL29125 (RGB)

Features: mature, well-documented, practical app notes.
Use: industrial and consumer backlight; entry-level color sensing.
Notes: tune range bits for indoor vs outdoor to avoid clipping.
Alt: ISL29023 ≈ TI OPT3001; ISL29125 ≈ ST VD6281 (domain).

onsemi

NOA1305 (ALS) · AR0144 (CMOS image sensor, industrial vision)

Features: strong ALS/imaging portfolio; robust automotive lineage.
Use: outdoor light control; machine-vision front ends.
Notes: for ALS, manage saturation under direct sun with integration/gain.
Alt: NOA1305 ≈ Renesas ISL29023 / TI OPT3001 (domain).

Microchip

Combo: Photodiode + MCP3421 (hi-res I²C ADC) + MCP6071 (op-amp) / MCP6561 (comparator)

Features: precision & customizable analog chain; AVR/PIC MCUs can read directly.
Use: fine-resolution lux or tailored spectra where ICs don’t fit.
Notes: allocate time for calibration & temperature drift mitigation.
Alt: compare TI ADS1115 or NXP PCF8591 (specs differ).

Melexis

MLX75305 (UVA) · MLX75306 (ALS with auto optical calibration)

Features: strong in automotive UV/ALS; options for cabin/external sensing.
Use: automotive ambient/cabin, instrument backlight, outdoor glare handling.
Notes: define AEC-Q target grade and PPAP early with purchasing.
Alt: UV PDs from other vendors can be function-matched (not pin-compatible).

Pin-to-Pin & Cross-Brand Tips

Function-domain equivalents: ALS → OPT3001 ≈ ISL29023 ≈ NOA1305; RGB → VD6281 ≈ ISL29125; UV → MLX75305/306 class.
True pin-to-pin: verify package, pin map, INT polarity, and I²C address straps—don’t assume drop-in compatibility across brands.
AEC-Q100: specify grade, temperature range, PPAP/traceability in your RFQ.
Small batch options: request Partial Reel and a Sample-kit for bring-up.

Representative picks across seven brands: ALS, RGB, UV, and ToF/proximity families, plus ADC+photodiode combo paths.

Tell us your target: lux/color/UV/distance, interface & supply, AEC-Q need, and whether you want Partial Reel/Sample-kit. We’ll return lead-time & alternatives within 48 hours.

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8) Mini-FAQ

A) Basics

Is a light sensor an IC or a component?

Both. It can be a discrete part (photodiode/phototransistor/LDR with TIA/comparator) or a sensor IC that integrates AFE+ADC and talks I²C/SPI. For most builds, ICs give faster time-to-market, better linearity and anti-flicker. See Section 1 · Section 4.

LDR vs photodiode vs ALS IC

Speed/linearity: photodiode > phototransistor > LDR. Temperature drift: LDR worst (many involve cadmium—check RoHS). ALS ICs add human-eye response and 50/60 Hz anti-flicker for stable lux. See Section 3 · Section 4.

Can a light sensor detect color or UV?

Yes—use dedicated RGB/Color ICs for color and UV IC/photodiodes for UVA/UVB. A generic ALS or LDR does not measure color/UV accurately. See Section 3 · Section 7.

Is a light sensor analog or digital?

The physical signal is analog. Discrete parts feed an ADC/comparator; sensor ICs digitize on chip and expose I²C/SPI. “Digital interface ≠ digital physical quantity.” See Section 2.

What triggers false alarms?

50/60 Hz lighting flicker, direct sun/headlights, shiny reflections, PIR heat sources/airflow, and self-illumination. Fix with anti-flicker + proper integration, hysteresis, and optical hood/diffuser. See Section 5 · Section 6.

B) Design & Troubleshooting

How to quickly check a sensor?

LDR: cover vs flashlight—resistance typically shifts from 100 k–1 MΩ → 1–10 kΩ. ALS IC: read raw counts & saturation/INT flags. PD+TIA: sweep a flashlight and scope the step/rise time. See Section 6.

Which resistor with an LDR?

Start with R_fixed ≈ R_LDR at your target lux. Divider law: V_out=V_CC·R_fixed/(R_fixed+R_LDR). Add comparator hysteresis of about 5–10%·V_CC to prevent chatter. See Section 2 · Section 6.

Can LEDs be used as light sensors?

Yes. A reverse-biased LED produces a small photocurrent; pair it with a TIA or high-impedance readout. Sensitivity depends on LED spectrum/package. See Section 2.

LiDAR vs LDR

LiDAR is active ranging (emitter + receiver, ToF algorithms), usually an IC/module. LDR is a passive light-dependent resistor for simple brightness thresholds—completely different categories. See Section 3.

Max voltage for LDR / wiring basics?

Follow the datasheet. Use series limits in dividers/bias networks, add ESD/TVS, and guard against reverse polarity and surges. For long runs, slow edges and share a clean ground. See Section 6.

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9) Submit Your BOM — 48h Turnaround

We commit to respond within 48 hours with: lead-time comparison, pin-to-pin alternatives, compliance mapping (AEC-Q / Industrial), and a sample-kit / partial-reel recommendation.

Applicable:

Display / Backlight Outdoor Dusk-to-Dawn Security / Motion-linked Lighting Automotive Cabin Sensing

What to include

Part number or function (ALS / RGB / UV / Proximity / ToF).
Qty bands (samples / small batch / mass) and packaging (Reel/Tray).
Interface & supply: I²C/SPI/INT, 1.8/3.3/5 V.
Target ranges: lux / CCT / UV / distance; 50/60 Hz requirement.
Temperature range, optics (FOV / diffuser / hooding).

Compliance & sourcing

AEC-Q100 grade, PPAP/traceability, RoHS/REACH.
Accept Partial Reel? Need a Sample-kit?
Allow cross-brand function equivalents? Require strict pin-to-pin?
Desired lead-time & alternates policy (OK to split brand?).

Supported formats

XLSX / CSV / PDF / image files.
Or paste plain text: one line per item (PN / Qty / Notes).
No exact PN? Describe constraints (e.g., “ALS, I²C, 3.3 V, 0–50k lux, AEC-Q100”).
NDA available on request; only traceable supply paths.

How it works (3 steps)

Submit your BOM (file upload or pasted list).
Engineering review: stock & lead-time check, package/pin/INT polarity/address validation, compliance mapping.
≤48 h report: lead-time table, pin-to-pin vs function-equivalent options, compliance & risks, sample/partial-reel plan.

What you get

Lead-time & MOQ/MPQ comparison table.
Alternatives list with pin map notes and drop-in feasibility.
Compliance mapping (AEC-Q / Industrial), PPAP availability.
Risk flags (EOL / volatility) and mitigation options.
Sample-kit & Partial-reel proposals for bring-up.

lead-time → compliance → pin-to-pin alternatives → risks — Review flow: lead-time, compliance (AEC-Q/Industrial), pin-to-pin alternatives, and risk assessment.

Submit your BOM

Include AEC-Q100 grade / Partial Reel / Sample-kit preferences for a faster match.

10) Further Reading

Deep-dive guides and featured IC pages to complete the topic cluster. Use the links below to move from fundamentals to parts selection—and back to this hub.