The STB28NM60ND from STMicroelectronics is a high-performance N-channel 600V power MOSFET designed for demanding switching applications. Part of the FDmesh™ II series, it combines low on-resistance (150mOhm @ 11.5A, 10V) with high current handling (23A continuous drain current @ 25°C) and robust thermal performance (190W max power dissipation). Its 600V drain-to-source voltage (Vdss) rating makes it suitable for high-voltage circuits, while the advanced MOSFET (Metal Oxide) technology ensures efficient power management. Although marked as "Not For New Designs", it remains a reliable choice for existing applications requiring high efficiency and durability.
High Voltage Tolerance: ±25V max Vgs and 600V Vdss provide robustness in harsh environments.
Thermal Stability: 150°C max junction temperature (TJ) and MSL 1 (Unlimited) moisture sensitivity ensure reliability.
Surface-Mount D2PAK Package: Compact and suitable for automated assembly (Tape & Reel packaging).
Compliance: ROHS3 and REACH Unaffected, meeting environmental standards.
STB28NM60ND Applications
Switching Power Supplies: Efficient energy conversion in AC-DC and DC-DC converters.
Motor Drives: High-current handling for industrial and automotive motor control.
Lighting Systems: Ideal for LED drivers and ballasts due to low Rds(on).
Renewable Energy: Solar inverters and wind power systems benefit from its high-voltage capability.
Industrial Equipment: Reliable performance in welding machines and UPS systems.
Conclusion of STB28NM60ND
The STB28NM60ND excels in high-voltage, high-efficiency applications, offering a balance of low conduction losses, fast switching, and thermal resilience. While newer alternatives may exist, its proven FDmesh™ II technology and D2PAK packaging make it a dependable choice for legacy designs or systems requiring rugged performance. Engineers valuing low Rds(on), high current capacity, and compliance with environmental standards will find this MOSFET a robust solution.
Tech Specifications
Configuration
Typical Turn-Off Delay Time (ns)
Maximum Gate Source Leakage Current (nA)
Input Capacitance (Ciss) (Max) @ Vds
Gate Charge (Qg) (Max) @ Vgs
Typical Rise Time (ns)
PPAP
Channel Mode
Typical Turn-On Delay Time (ns)
Product Status
Automotive
Drain to Source Voltage (Vdss)
Supplier Package
Maximum IDSS (uA)
Package / Case
Technology
REACH Status
Channel Type
EU RoHS
Maximum Continuous Drain Current (A)
Moisture Sensitivity Level (MSL)
Operating Temperature
Maximum Drain Source Voltage (V)
Maximum Drain Source Resistance (mOhm)
ECCN
Mounting Type
Rds On (Max) @ Id, Vgs
Standard Package Name
Vgs(th) (Max) @ Id
Pin Count
Mounting
Lead Shape
Current - Continuous Drain (Id) @ 25°C
SVHC
Drive Voltage (Max Rds On, Min Rds On)
HTSUS
Package
Typical Gate Charge @ Vgs (nC)
Typical Input Capacitance @ Vds (pF)
Category
PCB changed
HTS
FET Type
Number of Elements per Chip
ECCN (US)
Maximum Power Dissipation (mW)
Supplier Device Package
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Power Dissipation (Max)
Typical Fall Time (ns)
Process Technology
Package Height
Mfr
Vgs (Max)
RoHS Status
FET Feature
Maximum Gate Source Voltage (V)
SVHC Exceeds Threshold
Package Length
Typical Gate Charge @ 10V (nC)
Series
Tab
Part Status
Maximum Gate Threshold Voltage (V)
Package Width
Base Product Number
Unit Weight
Id - Continuous Drain Current
Fall Time
RoHS
Qg - Gate Charge
Transistor Type
Number of Channels
Typical Turn-On Delay Time
Maximum Operating Temperature
Rds On - Drain-Source Resistance
Mounting Style
Vgs - Gate-Source Voltage
Typical Turn-Off Delay Time
Transistor Polarity
Minimum Operating Temperature
Vds - Drain-Source Breakdown Voltage
Rise Time
Vgs th - Gate-Source Threshold Voltage
Pd - Power Dissipation
USHTS
STB28NM60ND Documents
Download datasheets and manufacturer documentation for STB28NM60ND
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Shipping Rate
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